The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Nov. 10, 2008
Applicants:

Brian J. Gates, Oscelola, WI (US);

Robert T. Krasa, Hudson, WI (US);

Travis L. Potts, Woodbury, MN (US);

Serge Wetzels, Newport, MN (US);

Inventors:

Brian J. Gates, Oscelola, WI (US);

Robert T. Krasa, Hudson, WI (US);

Travis L. Potts, Woodbury, MN (US);

Serge Wetzels, Newport, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 5/02 (2006.01); G03F 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A sheeting and a method of forming a sheeting from a master tool are described where the sheeting has a composite image that floats above or below the sheeting. The method includes providing a first sheeting comprising a first array of microlenses and a photopolymerizable first material layer adjacent to the first array of microlenses. Another step is exposing the first sheeting to a radiation source to form a master tool comprising a plurality of polymerized first structured areas in the first material layer, wherein at least some of the first structured areas include a portion shape in common with at least some of the first structured areas and wherein each first structured area is associated with one of the first array of microlenses. Yet another step is replicating the plurality of first structured areas using a substance that conforms to the plurality of structured areas to form a second material layer having a plurality of replicated structured areas.


Find Patent Forward Citations

Loading…