The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 19, 2013
Filed:
Sep. 15, 2008
Tsuneaki Ohashi, Nagoya, JP;
Masakatsu Inoue, Komaki, JP;
Toshiichi Ikami, Kounan, JP;
Keiichiro Watanabe, Kasugai, JP;
Kunihiko Yoshioka, Nagoya, JP;
Kazuhi Matsumoto, Nagoya, JP;
Tsuneaki Ohashi, Nagoya, JP;
Masakatsu Inoue, Komaki, JP;
Toshiichi Ikami, Kounan, JP;
Keiichiro Watanabe, Kasugai, JP;
Kunihiko Yoshioka, Nagoya, JP;
Kazuhi Matsumoto, Nagoya, JP;
NGK Insulators, Ltd., Nagoya, JP;
Abstract
A first inorganic powder molded body and a second inorganic powder molded body are obtained. Each of the bodies contains an inorganic powder, an organic dispersion medium having a reactive functional group and a gelling agent and is solidified by chemical reaction of the organic dispersion medium and the gelling agent. Slurry containing a powder component and an organic dispersion medium is applied to a joint surface of the first inorganic powder molded body. The inorganic powder molded bodies are allowed to abut on each other while interposing the slurry therebetween, and integrated together into a joined body. A sintered body is obtained by sintering the joined body.