The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 19, 2013

Filed:

Aug. 26, 2010
Applicants:

Ivan a Cornejo, Corning, NY (US);

Sinue Gomez, Corning, NY (US);

James Micheal Harris, Elmira, NY (US);

Lisa Anne Moore, Corning, NY (US);

Sergio Tsuda, Horseheads, NY (US);

Inventors:

Ivan A Cornejo, Corning, NY (US);

Sinue Gomez, Corning, NY (US);

James Micheal Harris, Elmira, NY (US);

Lisa Anne Moore, Corning, NY (US);

Sergio Tsuda, Horseheads, NY (US);

Assignee:

Corning Incorporated, Corning, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Glass interposer panels and methods for forming the same are described herein. The interposer panels include a glass substrate core formed from an ion-exchangeable glass. A first layer of compressive stress may extend from a first surface of the glass substrate into the thickness T of the glass substrate core to a first depth of layer D. A second layer of compressive stress may be spaced apart from the first layer of compressive stress and extending from a second surface of the glass substrate core into the thickness T of the glass substrate core to a second depth of layer D. A plurality of through-vias may extend through the thickness T of the glass substrate core. Each through-via is surrounded by an intermediate zone of compressive stress that extends from the first layer of compressive stress to the second layer of compressive stress adjacent to a sidewall of each through-via.


Find Patent Forward Citations

Loading…