The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Jun. 02, 2011
Applicants:
Stephan Dertinger, Heidelberg, DE;
Alfred Martin, Munich, DE;
Barbara Hasler, Munich, DE;
Grit Sommer, Grafing, DE;
Florian Binder, Gauting, DE;
Inventors:
Stephan Dertinger, Heidelberg, DE;
Alfred Martin, Munich, DE;
Barbara Hasler, Munich, DE;
Grit Sommer, Grafing, DE;
Florian Binder, Gauting, DE;
Assignees:
Infineon Technologies AG, Neubiberg, DE;
Qimonda AG, Munich, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01);
U.S. Cl.
CPC ...
Abstract
An integrated circuit having a semiconductor substrate with a barrier layer is disclosed. The arrangement includes a semiconductor substrate and a metallic element. A carbon-based barrier layer is disposed between the semiconductor substrate and the metallic element.