The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Mar. 31, 2008
Myung Geun Park, Seoul, KR;
Myung Geun Park, Seoul, KR;
Hynix Semiconductor Inc., Kyoungki-do, KR;
Abstract
The present invention relates to a substrate for a semiconductor package and a semiconductor package having the same. A substrate for a semiconductor package includes a substrate body; a contact pad group including a plurality of contact pads parallely arranged at a determined interval on a surface of the substrate body; dummy contact pads arranged at both sides of the contact pad group, respectively; and solder resist patterns covering the substrate body and having openings exposing the dummy contact pads and the contact pad group. When bumping the semiconductor chip having the bumps to the solders arranged on the contact pads formed on the substrate, the bumping defect caused due to different volumes of each solder can be prevented.