The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Dec. 27, 2010
Applicant:
Jin Hui Lee, Icheon-si, KR;
Inventor:
Jin Hui Lee, Icheon-si, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 29/06 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/34 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor chip includes a semiconductor chip body having a top surface, a bottom surface, and side surfaces. The bottom surface may have a groove pattern defined by removing a partial thickness of the semiconductor chip body to extend from one or more edges of the semiconductor chip body toward a center portion of the semiconductor chip body. Through electrodes may be formed to extend from the top surface of the semiconductor chip body and pass through the groove pattern defined on the bottom surface. A heat dissipation pattern may fill in the groove pattern defined on the bottom surface and may be connected with the through electrodes.