The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Apr. 26, 2011
Atsushi Himeno, Osaka, JP;
Haruyuki Sorada, Okayama, JP;
Takumi Mikawa, Shiga, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A manufacturing method includes forming, on a substrate, lower layer copper lines each being shaped into a strip, forming electrode seed layers each being shaped into a strip, on the respective lower layer copper lines using electroless plating, forming an interlayer insulating layer above the electrode seed layers, forming, in the interlayer insulating layer, memory cell holes, penetrating through the interlayer insulating layer and extending to the electrode seed layers, forming noble metal electrode layers on the electrode seed layers exposed in the respective memory cell holes using the electroless plating, forming, in the respective memory cell holes, variable resistance layers connected to the noble electrode layers, and forming, above the interlayer insulating layer and the variable resistance layers, upper layer copper lines each being shaped into a strip, connected to a corresponding one of the variable resistance layers, and crossing the lower layer copper lines.