The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2013

Filed:

Aug. 25, 2006
Applicants:

Kosei Aso, Kanagawa, JP;

Yoshinari Sasaki, Tokyo, JP;

Hidehisa Murase, Kanagawa, JP;

Naoki Yamada, Kanagawa, JP;

Inventors:

Kosei Aso, Kanagawa, JP;

Yoshinari Sasaki, Tokyo, JP;

Hidehisa Murase, Kanagawa, JP;

Naoki Yamada, Kanagawa, JP;

Assignees:

Sony Corporation, Tokyo, JP;

Exitech Limited, Oxford, GB;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/14 (2006.01); B23K 26/12 (2006.01); B23K 26/36 (2006.01);
U.S. Cl.
CPC ...
B23K 26/1476 (2013.01); B23K 26/123 (2013.01); B23K 26/367 (2013.01);
Abstract

A laser processing apparatus is provided. The laser processing apparatus includes a laser processing head having a transmission window, an opening portion, an outlet hole, a first vent hole and a second vent hole. The transmission window transmits laser light by which a processing object is irradiated. The opening portion passes the transmitted laser light to a bottom portion of the laser processing head. The outlet hole discharges an atmosphere in the vicinity of a laser light irradiation region of the processing object to the outside. The first vent hole directs gas into the vicinity of the laser light irradiation region. The second vent hole discharges the atmosphere in the vicinity of the laser light irradiation region. Debris generated from the processing object is discharged from the outlet hole and the second vent hole that are continuous with the opening portion provided at the bottom portion of the laser processing head.


Find Patent Forward Citations

Loading…