The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Dec. 30, 2011
Dein-run Fung, Taipei, TW;
Te-chao Liao, Taipei, TW;
Hao-sheng Chen, Taipei, TW;
Nan Ya Plastics Corporation, Taipei, TW;
Abstract
A resin composition includes solid brominated epoxy resin of 20-70 wt %, a hardener of 1-10 wt %, a promoter of 0.1-10 wt %, inorganic powder of 0.01-20 wt %, high thermal conductivity powder of 5-85 wt % closest packed by Horsfield packing model and a processing aid of 0-10 wt %; the resin composition possesses high glass transition temperature ranged from 169° C. to 235° C. measured by DSC, high thermal conductivity ranged from 5.7 W/m·K to 14.2 W/m·K, and excellent heat resistance as well as flame retardancy. The resin composition, which acts as a dielectric layer of a printed circuit board so as to endow the PCB with high thermal conductivity, is a high thermal conductivity prepreg formed by retting or a high thermal conductivity coating formed by coating. As a result, prompt dissipation of heat generated by electronic components on the PCB is achievable so that service life and stability of the electronic components are improved.