The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Feb. 24, 2011
Hsien-ping Feng, Watertown, MA (US);
Gang Chen, Carlisle, MA (US);
Yu BO, Chesnut Hill, MA (US);
Zhifeng Ren, Newton, MA (US);
Shuo Chen, Newton, MA (US);
Bed Poudel, Newtonville, MA (US);
Hsien-Ping Feng, Watertown, MA (US);
Gang Chen, Carlisle, MA (US);
Yu Bo, Chesnut Hill, MA (US);
Zhifeng Ren, Newton, MA (US);
Shuo Chen, Newton, MA (US);
Bed Poudel, Newtonville, MA (US);
Massachusetts Institute of Technology, Cambridge, MA (US);
The Trustees of Boston College, Chestnutt Hill, MA (US);
GMZ Energy, Inc., Waltham, MA (US);
Abstract
Methods of forming a conductive metal layers on substrates are disclosed which employ a seed layer to enhance bonding, especially to smooth, low-roughness or hydrophobic substrates. In one aspect of the invention, the seed layer can be formed by applying nanoparticles onto a surface of the substrate; and the metallization is achieved by electroplating an electrically conducting metal onto the seed layer, whereby the nanoparticles serve as nucleation sites for metal deposition. In another approach, the seed layer can be formed by a self-assembling linker material, such as a sulfur-containing silane material.