The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 12, 2013
Filed:
Jan. 11, 2011
Physical quantity sensor including bonding wire with vibration isolation performance characteristics
Tameharu Ohta, Takahama, JP;
Takeshi Shinoda, Nagoya, JP;
Itaru Ishii, Okazaki, JP;
Keisuke Nakano, Nukata, JP;
Tameharu Ohta, Takahama, JP;
Takeshi Shinoda, Nagoya, JP;
Itaru Ishii, Okazaki, JP;
Keisuke Nakano, Nukata, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A physical quantity sensor includes a sensing portion, a casing, a vibration isolating member, an electrically conductive portion, a pad and a bonding wire. The casing encases the sensing portion therein. The vibration isolating member is disposed between the sensing portion and the casing to reduce a relative vibration between the sensing portion and the casing. The bonding wire electrically connects the electrically conductive portion provided on the casing and the pad provided on a surface of the sensing portion. The bonding wire extends from the pad to the electrically conductive portion and includes a bend. The bonding wire is configured to satisfy a relation of 20×d≦h, in which d is an outer diameter of the bonding wire, and h is a dimension of the bonding wire with respect to a direction perpendicular to the surface of the sensing portion.