The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2013

Filed:

Sep. 01, 2011
Applicants:

Seiji Oka, Tokyo, JP;

Shiori Idaka, Tokyo, JP;

Hiroshi Yoshida, Tokyo, JP;

Inventors:

Seiji Oka, Tokyo, JP;

Shiori Idaka, Tokyo, JP;

Hiroshi Yoshida, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A power semiconductor device includes a conductive insertion member as an external terminal projecting from a surface of the power semiconductor device facing a printed wiring board. The printed wiring board includes a conductive fitting member mounted on a pad part of the printed wiring board. The fitting member receives the insertion member therein when the power semiconductor device is connected to the printed wiring board. The insertion member has a recessed portion formed on a side surface of the insertion member. The fitting member has a projecting portion with elasticity formed on an inner side surface of the fitting member. The elasticity causes the projecting portion of the fitting member to contact the recessed portion of the insertion member under pressure when the insertion member is inserted into the fitting member.


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