The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Feb. 25, 2011
Young-sang Cho, Yongin-si, KR;
Chang-sig Kang, Hwaseong-si, KR;
Dae-woo Son, Cheonan-si, KR;
Yun-seok Choi, Hwaseong-si, KR;
Kyong-soon Cho, Goyang-si, KR;
Sang-heul Lee, Cheonan-si, KR;
Young-Sang Cho, Yongin-si, KR;
Chang-Sig Kang, Hwaseong-si, KR;
Dae-Woo Son, Cheonan-si, KR;
Yun-Seok Choi, Hwaseong-si, KR;
Kyong-Soon Cho, Goyang-si, KR;
Sang-Heul Lee, Cheonan-si, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor chip for a tape automated bonding (TAB) package is disclosed. The semiconductor chip comprises a connection surface including a set of input pads connected to internal circuitry of the chip and for conveying external signals to the internal circuitry, the set of input pads comprising all of the input pads on the chip. The connection surface includes a set of output pads connected to internal circuitry of the chip and for conveying internal chip signals to outside the chip, the set of output pads comprising all of the output pads on the chip.