The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2013

Filed:

Jun. 15, 2009
Applicants:

Shinji Ujita, Osaka, JP;

Takeshi Fukuda, Osaka, JP;

Hiroyuki Sakai, Kyoto, JP;

Inventors:

Shinji Ujita, Osaka, JP;

Takeshi Fukuda, Osaka, JP;

Hiroyuki Sakai, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor integrated circuit device with a balun which is formed above a conductive semiconductor substrate and which includes a dielectric film, an unbalanced line for transmitting an unbalanced signal, and balanced lines for transmitting a balanced signal. The unbalanced line is placed opposite to the balanced lines via a nano-composite film that is a region of the dielectric film. The nano-composite film, interposed between the unbalanced line and the balanced lines, has a relative permittivity higher than that of other regions of the dielectric film. This allows suppression of electromagnetic coupling of transmission lines or passive elements other than the balun, thereby providing a semiconductor device with a wide-band and small-size balun.


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