The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8575729 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 05, 2013

Filed:

May. 13, 2011
Applicants:

Masao Uchida, Osaka, JP;

Masashi Hayashi, Osaka, JP;

Inventors:

Masao Uchida, Osaka, JP;

Masashi Hayashi, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 29/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

The semiconductor chip () of the present invention is a semiconductor chip () on which a power semiconductor device () is formed, and which includes a semiconductor substrate made from a hexagonal semiconductor, in which the semiconductor substrate has a shape of a rectangle on a principal surface, in which the rectangle is defined by two sides having lengths a and b equal to each other, and in which linear expansion coefficients in directions parallel to the two sides of the semiconductor substrate are equal to each other.


Find Patent Forward Citations

Uchida, Masao. (2013). Semiconductor chip with linear expansion coefficients in direction parallel to sides of hexagonal semiconductor substrate and manufacturing method (U.S. Patent No. 8575729). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8575729

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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