The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Aug. 23, 2012
Ryuichi Okamura, Kanagawa, JP;
Ryuichi Okamura, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
A semiconductor device, which exhibits an increased design flexibility for a capacitor element, and can be manufactured with simple method, is provided. A semiconductor deviceincludes: a silicon substrate; an interlayer filmprovided on the silicon substrate; a multiple-layered interconnect embedded in the interlayer film; a flip-chip pad, provided so as to be opposite to an upper surface of an uppermost layer interconnectin the multiple-layered interconnect and having a solder ballfor an external coupling mounted thereon; and a capacitance filmprovided between said uppermost layer interconnectand the flip-chip pad. Such semiconductor deviceincludes the flip-chip padcomposed of an uppermost layer interconnect, a capacitive filmand a capacitor element