The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8575721 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 05, 2013

Filed:

Aug. 23, 2012
Applicant:

Ryuichi Okamura, Kanagawa, JP;

Inventor:

Ryuichi Okamura, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device, which exhibits an increased design flexibility for a capacitor element, and can be manufactured with simple method, is provided. A semiconductor deviceincludes: a silicon substrate; an interlayer filmprovided on the silicon substrate; a multiple-layered interconnect embedded in the interlayer film; a flip-chip pad, provided so as to be opposite to an upper surface of an uppermost layer interconnectin the multiple-layered interconnect and having a solder ballfor an external coupling mounted thereon; and a capacitance filmprovided between said uppermost layer interconnectand the flip-chip pad. Such semiconductor deviceincludes the flip-chip padcomposed of an uppermost layer interconnect, a capacitive filmand a capacitor element


Find Patent Forward Citations

Okamura, Ryuichi. (2013). Semiconductor device (U.S. Patent No. 8575721). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8575721

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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