The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2013

Filed:

Jul. 14, 2008
Applicants:

Morihisa Ota, Kusatsu, JP;

Taizo Kobayashi, Uji, JP;

Akihiro Funamoto, Kyoto, JP;

Shigeru Aoyama, Kizugawa, JP;

Inventors:

Morihisa Ota, Kusatsu, JP;

Taizo Kobayashi, Uji, JP;

Akihiro Funamoto, Kyoto, JP;

Shigeru Aoyama, Kizugawa, JP;

Assignee:

OMRON Corporation, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An alloy substrate formed on an alloy of Ni and Mo is formed by electroforming. The alloy substrate has graded composition in which alloy composition varies in a thickness direction thereof. A lower surface side is mainly composed of Ni, and a upper surface side is mainly composed of Mo. An upper surface of the alloy substrate is formed with a large number of minute and pyramidal unevenness having high light scattering property. A CIS light absorbing layer is formed on the upper surface of the alloy substrate, and an upper electrode is provided thereabove.


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