The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8575012 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 05, 2013

Filed:

Apr. 28, 2011
Applicant:

Masaki Haneda, Yokohama, JP;

Inventor:

Masaki Haneda, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device production method includes: forming an insulating film on a semiconductor substrate, forming a concave portion in the insulating film, forming a gate insulating film at bottom of the concave portion, the bottom being on the semiconductor substrate; covering an inner wall surface of the concave portion and a top face of the insulating film with a first gate electrode film that is made of an electrically conductive material containing a first metal; covering the first gate electrode film with a covering film of a material having a second melting point higher than a first melting point of the electrically conductive material, leaving part of the side face of the concave portion uncovered; and performing heat treatment following the covering film formation to allow the first gate electrode film to reflow.


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Haneda, Masaki. (2013). Semiconductor device production method and semiconductor device (U.S. Patent No. 8575012). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8575012

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