The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 05, 2013
Filed:
Jul. 28, 2011
Marcel Broekaart, Theys, FR;
Gweltaz Gaudin, Grenoble, FR;
Arnaud Castex, Grenoble, FR;
Soitec, Bernin, FR;
Abstract
A method for the direct bonding of a first wafer having an intrinsic curvature before bonding to a second wafer having an intrinsic curvature before bonding, at least one of the two wafers including at least one series of microcomponents. The method includes bringing the two wafers into contact with each other so as to initiate the propagation of a bonding wave therebetween while imposing a predefined bonding curvature in the form of a paraboloid of revolution on one of the two wafers depending at least upon the intrinsic curvature before bonding of the wafer that includes the microcomponents, with the other wafer being free to conform to the predefined bonding curvature.