The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2013

Filed:

Mar. 23, 2011
Applicants:

Dein-run Fung, Taipei, TW;

Sen-huang Hsu, Taipei, TW;

Hung-hsun Wu, Taipei, TW;

Huei-jiun Juang, Taipei, TW;

Inventors:

Dein-Run Fung, Taipei, TW;

Sen-Huang Hsu, Taipei, TW;

Hung-Hsun Wu, Taipei, TW;

Huei-Jiun Juang, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01); B32B 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An environmentally friendly water-based heat-expandable adhesive panel, having high adhesiveness and containing solvent-free resins, comprises a substrate layer functioning as a base layer, a primer layer coated on the substrate layer and a heat-expandable layer coated on the primer layer, which is for use in an electronic or plastic component processing process to adhesively fix electronic or plastic components in place temporarily and separate, upon completion of the processing process and commencement of a component-reactivating process, the components from the water-based heat-expandable adhesive panel by heating the water-based heat-expandable adhesive panel at a fixed temperature for a specific period of time, so as to reduce volatile organic compound (VOC) emissions and effectuate environmental protection.


Find Patent Forward Citations

Loading…