The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 05, 2013

Filed:

Jan. 27, 2010
Applicants:

Seiji Tsuji, Nagoya, JP;

Hidehiro Takemoto, Tokyo, JP;

Masaaki Yamasaki, Nagoya, JP;

Inventors:

Seiji Tsuji, Nagoya, JP;

Hidehiro Takemoto, Tokyo, JP;

Masaaki Yamasaki, Nagoya, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a RTM method wherein a molding die composed of a temperature control mechanism, which is arranged on at least one of a plurality of dies that form a molding die and adjusts the temperature of the die, and a valve mechanism, which starts and stops supply of a resin in a state of having fluidity to the cavity of the molding die, is used. In the method, a plurality of the valve mechanisms are arranged on the molding die, each of the valve mechanisms is provided with one or a plurality of temperature control systems which adjust the temperature of the valve mechanism, the resin in the state of having fluidity is supplied to the cavity from the valve mechanisms, and a reinforcing fiber base material contained in the cavity is impregnated with the resin.


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