Process and apparatus for molding a shingle, for cooling a shingle, for applying a curvature thereto and carrier plate for facilitating the process

Abstract

Shingle material, preferably comprising a core with a capstock applied thereto is extruded, preferably by means of a co-extrusion process, onto a series of individual carrier plates, with the shingle material then being severed such that each carrier plate carries its own layer of shingle material thereon and the carrier plates are then delivered to a compression mold, in which the shingle is molded. The carrier plate and shingle is then removed from the mold and carried through a series of hold-down stations, after which the shingle is delivered to a trimmer, where flashing is simultaneously trimmed from its edges. The shingle is then cooled, preferably by sandwiching it between upper and lower retention members, which are cooled via a cooling tower. The retention members impart a curvature to the shingle. The carrier plates are returned via a return conveyor, to be heated, for re-use. Each carrier plate is preferably configured to have a reciprocal surface configuration for the under side of a shingle for providing a surface mold therefor.