The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8570763 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 29, 2013

Filed:

Dec. 28, 2009
Applicant:

Yasuyuki Sekimoto, Ritto, JP;

Inventor:

Yasuyuki Sekimoto, Ritto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 7/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A high quality component-incorporated substrate achieves a sufficient connection between an in-plane electrode and an interlayer connection conductor at low cost. A method of forming a hole for an interlayer connection conductor of a resin substrate includes a step of forming an in-plane electrode in a core substrate, a step of forming a light reflective conductor for reflecting a laser beam applied on the in-plane electrode in a later step, a step of forming a resin layer so as to cover the core substrate, the in-plane electrode and the light reflective conductor, and a step of forming a hole for the interlayer connection conductor by removing the resin layer on the light reflective conductor through the use of a laser beam.


Find Patent Forward Citations

Sekimoto, Yasuyuki. (2013). Method of forming hole for interlayer connection conductor, method of producing resin substrate and component-incorporated substrate, and resin substrate and component-incorporated substrate (U.S. Patent No. 8570763). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8570763

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