The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2013

Filed:

Aug. 26, 2005
Applicants:

Do-hyung Kim, Suwon, KR;

Moon-whan Shin, Seoul, KR;

Woong-joon Hwang, Seoul, KR;

Chung-hoon Lee, Gyeonggi-Do, KR;

Inventors:

Do-Hyung Kim, Suwon, KR;

Moon-Whan Shin, Seoul, KR;

Woong-Joon Hwang, Seoul, KR;

Chung-Hoon Lee, Gyeonggi-Do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 1/02 (2006.01); H01J 7/24 (2006.01); H01J 61/52 (2006.01); H01K 1/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a luminous device with a heat pipe formed therein and a heat pipe lead for a luminous device. The present invention provides a luminous device including a heat pipe lead or electrode and a luminous chip mounted onto the heat pipe lead or electrode. The luminous device of the present invention further comprises a heat dissipation member, such as a heat radiating plate or thermoelectric device, installed at an end of the heat pipe lead or electrode. Therefore, through the heat pipe lead or electrode of the present invention, a higher heat dissipation effect greater can be obtained as compared with the conventional one. As a result, it is possible to reduce thermal stress on a luminous device and to prevent the occurrence of a phenomenon in which external impurities penetrate into the luminous device. In addition, the cooling efficiency and the light-emitting efficiency of a luminous chip can be maximized by further disposing a heat dissipation member outside the heat pipe.


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