The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Nov. 16, 2010
Tomohisa Kurita, Kasugai, JP;
Hideo Yumi, Kasugai, JP;
Tatsuya Nakamura, Inuyama, JP;
Kenji Konda, Nagoya, JP;
Hiroki Kitano, Kasugai, JP;
Tomohisa Kurita, Kasugai, JP;
Hideo Yumi, Kasugai, JP;
Tatsuya Nakamura, Inuyama, JP;
Kenji Konda, Nagoya, JP;
Hiroki Kitano, Kasugai, JP;
Kitagawa Industries Co., Ltd., Naka-Ku, Nagoya-Shi, Aichi-Ken, JP;
Abstract
A contact includes a solder bonding portion, an elastic contact portion, and a suction portion. An undersurface of the solder bonding portion is a solder bonding face which is to be solder bonded to the conductor pattern. The elastic contact portion is connected to one end of the solder bonding portion and bent over the solder bonding portion. When in contact with a conductive member, the elastic contact portion is pressed against the conductive member while being elastically deformed. The suction portion is connected to the solder bonding portion independently of the elastic contact portion. The suction portion is made a suction face for a suction nozzle of an automatic mounter, with its top end being arranged in parallel to the undersurface of the solder bonding portion on the conductive member side of the elastic contact portion.