The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Nov. 25, 2009
Russell A. Stapleton, Apex, NC (US);
Russell A. Stapleton, Apex, NC (US);
Lord Corporation, Cary, NC (US);
Abstract
In a first aspect of the present invention, a method for manufacturing a flip chip package is provided comprising the steps of a) providing a chip having electrically conductive pads on an active surface thereof, b) coating at least a portion the chip with a protectant composition comprising a polymerizable component comprising a thermosetting epoxy resin, at least 50 weight percent of a substantially transparent filler having a coefficient of thermal expansion of less than 10 ppm/° C., a photoinitator, and a solvent carrier, wherein the protectant composition comprises a thixotropic index of less than 1.5, c) masking the coated chip to mask areas where vias through the protectant are desired, d) exposing the masked chip to a light source sufficient to partially crosslink the protectant composition in the unmasked areas, e) removing the uncured portions of the protectant composition thereby creating vias through the protectant composition to the electrically conductive pads on the surface of the chip, f) applying an electrically conductive material to the chip through the vias, wherein the electrically conductive material protrudes from the surface of the protectant composition, and g) heating the chip to a temperature sufficient to reflow the electrically conductive material and thermoset the protectant composition.