The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 29, 2013
Filed:
Sep. 17, 2010
Doo-young Jung, Uiwang-si, KR;
Ji-young Jeong, Uiwang-si, KR;
Hyun-yong Cho, Uiwang-si, KR;
Yong-sik Yoo, Uiwang-si, KR;
Kil-sung Lee, Uiwang-si, KR;
Myoung-hwan Cha, Uiwang-si, KR;
Doo-Young Jung, Uiwang-si, KR;
Ji-Young Jeong, Uiwang-si, KR;
Hyun-Yong Cho, Uiwang-si, KR;
Yong-Sik Yoo, Uiwang-si, KR;
Kil-Sung Lee, Uiwang-si, KR;
Myoung-Hwan Cha, Uiwang-si, KR;
Cheil Industries Inc., Gumi-si, KR;
Abstract
A positive photosensitive resin composition according to one embodiment of the present invention includes a polyamic acid or a polyamic acid ester compound including a repeating unit represented by Formula 1 defined in this specification, a photosensitive diazoquinone compound, a silane compound, a phenol compound, and a solvent. The positive photosensitive resin composition can be cured at a low temperature of 260° C. or less, and can have high sensitivity, resolution, residue removal, substrate adherence, and pattern-forming capabilities, and low film shrinkage.