The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8568861 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 29, 2013

Filed:

Mar. 04, 2013
Applicant:

Samsung Electro-mechanics Co., Ltd., Gyunggi-do, KR;

Inventors:

Myung Gun Chong, Gyeongsangnam-do, KR;

Cheol Ho Heo, Busan-si, KR;

Sang Hyuk Son, Gyeongsangnam-do, KR;

Dae Hyung You, Gyeongsangnam-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a metallic laminate and a manufacturing method of a light emitting diode package using the same. The present invention provides a metallic laminate including: a core layer made of an insulating material; a metal layer disposed on one surface of the core layer; a heat radiating metal layer disposed on the other surface of the core layer; and a protective metal oxide layer disposed along an outer surface of the heat radiating metal layer and made of an oxide of the heat radiating metal layer.


Find Patent Forward Citations

Chong, Myung. (2013). Metallic laminate and manufacturing method of light emitting diode package using the same (U.S. Patent No. 8568861). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8568861

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