The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 29, 2013

Filed:

Mar. 27, 2009
Applicants:

Minako Inukai, Kawasaki, JP;

Hiroshi Tomita, Yokohama, JP;

Kaori Umezawa, Kamakura, JP;

Yasuhito Yoshimizu, Yokohama, JP;

Linan Ji, Yokohama, JP;

Inventors:

Minako Inukai, Kawasaki, JP;

Hiroshi Tomita, Yokohama, JP;

Kaori Umezawa, Kamakura, JP;

Yasuhito Yoshimizu, Yokohama, JP;

Linan Ji, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B08B 3/00 (2006.01); B08B 3/12 (2006.01); B08B 6/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A cleaning apparatus for a semiconductor wafer includes: a gas jet device including a gas nozzle which jets a first gas onto the surface of a semiconductor wafer to thin the thickness of a stagnant layer on the surface of the semiconductor wafer; and a two-fluid jet device including a two-fluid nozzle which jets droplet mist onto a region where thickness of the stagnant layer of the semiconductor wafer is thinned, the droplet mist being mixed two-fluid of a liquid and a second gas.


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