The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Nov. 10, 2011
Tomonaga Nishikawa, Tokyo, JP;
Makoto Yoshida, Tokyo, JP;
Tomokazu Ito, Tokyo, JP;
Hiroshi Kamiyama, Tokyo, JP;
Takeshi Okumura, Tokyo, JP;
Sho Nakagomi, Tokyo, JP;
Tomonaga Nishikawa, Tokyo, JP;
Makoto Yoshida, Tokyo, JP;
Tomokazu Ito, Tokyo, JP;
Hiroshi Kamiyama, Tokyo, JP;
Takeshi Okumura, Tokyo, JP;
Sho Nakagomi, Tokyo, JP;
TDK Corporation, Tokyo, JP;
Abstract
A coil componentis provided with a substrate, a thin-film coil layerprovided on the substrate, first and second bump electrodesprovided on a surface of the thin-film coil layer, a first lead conductorprovided on the surface of the thin-film coil layertogether with the first and second bump electrodesand formed integrally with the first bump electrode, and an insulator layerprovided between the first bump electrodeand the second bump electrode. The thin-film coil layercontains a first spiral conductorwhich is a plane coil pattern. The first bump electrodeis connected to an internal peripheral end of the first spiral conductorvia the first lead conductor. The second bump electrodeis connected to an external peripheral end of the first spiral conductor