The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2013

Filed:

Feb. 23, 2010
Applicants:

IN Kuk Cho, Seoul, KR;

Kyoung Taek Park, Seoul, KR;

Sang Soo Kwak, Seoul, KR;

Eun Jin Kim, Seoul, KR;

Jin Young Son, Seoul, KR;

Chang Hwa Park, Seoul, KR;

Inventors:

In Kuk Cho, Seoul, KR;

Kyoung Taek Park, Seoul, KR;

Sang Soo Kwak, Seoul, KR;

Eun Jin Kim, Seoul, KR;

Jin Young Son, Seoul, KR;

Chang Hwa Park, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead frame comprises: a base metal layer; a copper plating layer, including one of a copper layer and an alloy layer including a copper, configured to plate the based metal layer to make a surface roughness; and an upper plating layer, including at least one plating layer including at least one selected from the group of a nickel, a palladium, a gold, a silver, a nickel alloy, a palladium alloy, a gold alloy, and a silver alloy, configured to plate the copper plating layer.


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