The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
May. 24, 2012
Yoshihiro Yoneda, Yokohama, JP;
Hirohiko Kobayashi, Yokohama, JP;
Kenji Koyama, Yokohama, JP;
Masaki Yanagisawa, Yokohama, JP;
Kenji Hiratsuka, Yokohama, JP;
Yoshihiro Yoneda, Yokohama, JP;
Hirohiko Kobayashi, Yokohama, JP;
Kenji Koyama, Yokohama, JP;
Masaki Yanagisawa, Yokohama, JP;
Kenji Hiratsuka, Yokohama, JP;
Sumitomo Electric Industries Ltd., Osaka, JP;
Abstract
A method of making a semiconductor optical integrated device includes the steps of forming, on a substrate, a plurality of semiconductor integrated devices including a first optical semiconductor element having a first bonding pad and a second optical semiconductor element; forming a plurality of bar-shaped semiconductor optical integrated device arrays by cutting the substrate, each of the semiconductor optical integrated device arrays including two or more semiconductor optical integrated devices; alternately arranging the plurality of semiconductor optical integrated device arrays and a plurality of spacers in a thickness direction of the substrate so as to be fixed in place; and forming a coating film on a facet of the semiconductor optical integrated device array. Furthermore, the spacer has a movable portion facing the first bonding pad, the movable portion protruding toward the first bonding pad and being displaceable in a protruding direction.