The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Mar. 12, 2010
Pierre Cusin, Villars-Burquin, CH;
Clare Golfier, La Neuveville, CH;
Jean-philippe Thiebaud, Cudrefin, CH;
Pierre Cusin, Villars-Burquin, CH;
Clare Golfier, La Neuveville, CH;
Jean-Philippe Thiebaud, Cudrefin, CH;
Nivarox-FAR S.A., Le Locle, CH;
Abstract
The invention relates to a method () of fabricating a mold (') including the following steps: (a) depositing () an electrically conductive layer on the top () and bottom () of a wafer () made of silicon-based material; (b) securing () the wafer to a substrate () using an adhesive layer; (c) removing () one part () of the conductive layer from the top of the wafer (); and (d) etching () the wafer as far as the bottom conductive layer () thereof in the shape () of the one part removed from the top conductive layer () to form at least one cavity () in the mold. The invention concerns the field of micromechanical parts, particularly, for timepiece movements.