The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 22, 2013

Filed:

Jan. 24, 2007
Applicants:

Shigeyuki Yasui, Rye Brook, NY (US);

Seiji Ota, Chiba, JP;

Takashi Sakuma, Narashino, JP;

Inventors:

Shigeyuki Yasui, Rye Brook, NY (US);

Seiji Ota, Chiba, JP;

Takashi Sakuma, Narashino, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/00 (2006.01); B32B 27/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a polypropylene-based adhesive having an MFR of 2.7 g/10 min or higher, as measured at 230 ° C. under a load of 2.16 kg, comprising a composition which contains 5-95 parts by weight of (A) an isotactic polypropylene, 95-5 parts by weight of (B) a propylene/ethylene random copolymer, and 0-40 parts by weight of (C) an ethylene/propylene random copolymer, wherein 100 parts by weight of the composition is graft modified with 0.001-5 parts by weight of an unsaturated carboxylic acid and/or a derivative thereof, and wherein (B) is characterized by the following (i) to (iii): (i) the propylene/ethylene random copolymer (B) contains 60-90 mol % units derived from propylene and 10-40 mol % units derived from ethylene; (ii) the melting point (Tm) is in the range of 40-120 ° C.; and (iii) the molecular weight distribution (Mw/Mn) is in the range of 1.0-3.0.


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