The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8562890 B1

PDF
Full Text
Expired
Date of Patent:
Oct. 22, 2013

Filed:

Jan. 25, 2011
Applicants:

Jonathan Aase, Redwood City, CA (US);

Cameron Frazier, San Carlos, CA (US);

John Thomas, Cupertino, CA (US);

Inventors:

Jonathan Aase, Redwood City, CA (US);

Cameron Frazier, San Carlos, CA (US);

John Thomas, Cupertino, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01);
U.S. Cl.
CPC ...
Abstract

A headset can include a cable structure connecting non-cable components such as jacks and headphones. The cable structure can be constructed using a molding process. Different approaches can be used to ensure that a conductor bundle extending through the cable structure remains centered within the cable structure during the molding process. In some cases, a movable tube can be placed in the mold such that the conductor bundle is retained within the tube. As material is injected into the mold and reaches the tube, the tube can be displaced and progressively removed from the mold. Alternatively, the movable tube can be constructed such that the tube may combine with injected material to form a shell of the cable structure. In some cases, gates from which material is provided in the mold can be positioned and controlled to facilitate the injection of material in the mold while maintaining the centered position of the conductor bundle.


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Aase, Jonathan. (2013). Method for molding a cable structure (U.S. Patent No. 8562890). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8562890

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