The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 22, 2013
Filed:
Nov. 30, 2009
Jonas Bankaitis, Horseheads, NY (US);
Michael John Moore, Corning, NY (US);
Jeffery Scott Stone, Addison, NY (US);
Paul Jeffrey Williamson, Corning, NY (US);
Chunhe Zhang, Horseheads, NY (US);
Jonas Bankaitis, Horseheads, NY (US);
Michael John Moore, Corning, NY (US);
Jeffery Scott Stone, Addison, NY (US);
Paul Jeffrey Williamson, Corning, NY (US);
Chunhe Zhang, Horseheads, NY (US);
Corning Incorporated, Corning, NY (US);
Abstract
Methods and apparatus for processing edge portions of a donor semiconductor wafer include controlling chemical mechanical polishing parameters to achieve chamfering of the edges of the donor semiconductor wafer; and alternatively or additionally flexing the donor semiconductor wafer to present a concave configuration, where edge portions thereof are pronounced as compared to a central surface area thereof, such that the pronounced edge portions of the donor semiconductor wafer are preferentially polished against a polishing surface in order to achieve the chamfering.