The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Jul. 16, 2009
Bart-hendrik Huisman, Eindhoven, NL;
Nicolas Mignot, Genas, FR;
Hendrik Jan Eggink, Eindhoven, NL;
Clemens Johannes Maria Lasance, Nijenen, NL;
Bart-Hendrik Huisman, Eindhoven, NL;
Nicolas Mignot, Genas, FR;
Hendrik Jan Eggink, Eindhoven, NL;
Clemens Johannes Maria Lasance, Nijenen, NL;
Koninlijke Philips N.V., Eindhoven, NL;
Abstract
A semiconductor cooling device for transferring heat from a semiconductor die (). The semiconductor cooling device includes a heat dissipator () that may be thermally coupled to a semiconductor module () to be cooled for dissipating heat from the semiconductor die (); a housing () in or on which the semiconductor die () is mounted; a fluid flow passage () for providing a forced fluid flow within the housing (); and a fluid path () arranged to guide the forced fluid flow in a first direction between the fluid flow passage () and the heat dissipator () and further arranged to guide the fluid flow along the heat dissipator () in a second direction different to the first direction. In a particular embodiment, the semiconductor cooling device is used to dissipate heat from an array of LEDs.