The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Aug. 05, 2011
Jin-woo Park, Seoul, KR;
Eunchul Ahn, Yongin-Si, KR;
Jin-Woo Park, Seoul, KR;
Eunchul Ahn, Yongin-Si, KR;
Samsung Electronics Co., Ltd., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a wiring board including an upper connection pad provided on a first surface and a lower connection pad provided on a second surface opposite to the first surface, a semiconductor chip having a bonding pad area in which a bonding pad is provided and an adhesive area except the bonding pad area, and being mounted on the first surface of the wiring board in a flip-chip manner such that the bonding pad is electrically connected to the upper connection pad, a first molding layer provided between the adhesive area of the semiconductor chip and the first surface of the wiring board, and a second molding layer provided between the bonding pad area of the semiconductor chip and the first area of the wiring board while covering the first surface of the wiring board and the semiconductor chip. The first molding layer has a lower modulus than the second molding layer.