The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Nov. 08, 2011
Applicants:
Joon-yong Park, Suwon-si, KR;
Yong Seok Han, Anyang-si, KR;
Jae Jun Lee, Suwon-si, KR;
Chul Ho Jeong, Gwangju, KR;
Inventors:
Joon-Yong Park, Suwon-si, KR;
Yong Seok Han, Anyang-si, KR;
Jae Jun Lee, Suwon-si, KR;
Chul Ho Jeong, Gwangju, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract
A patternable adhesive composition including at least one alkali soluble resin including an alkali soluble group and an acryloyl group, at least one radically polymerizable compound, at least one thermosettable compound, and at least one photo-radical initiator.
Park, Joon-Yong. (2013). Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package (U.S. Patent No. 8558388). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8558388
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile