The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Feb. 03, 2012
SI Han Kim, Yongin-si, KR;
Woong Sun Lee, Suwon-si, KR;
Si Han Kim, Yongin-si, KR;
Woong Sun Lee, Suwon-si, KR;
SK Hynix Inc., Gyeonggi-do, KR;
Abstract
A semiconductor package includes a first semiconductor chip having first bumps which are projectedly formed thereon; a first copper foil attachment resin covered on the first semiconductor chip to embed the first semiconductor chip, and formed such that a first copper foil layer attached on an upper surface of the first copper foil attachment resin is electrically connected with the first bumps; a second copper foil attachment resin including a second copper foil layer which is electrically connected with the first copper foil layer, and disposed on the first copper foil attachment resin; and a second semiconductor chip embedded in the second copper foil attachment resin in such a way as to face the first semiconductor chip, and having second bumps formed thereon which are electrically connected with the second copper foil layer.