The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Jun. 28, 2011
Kuniaki Mamitsu, Nukata-gun, JP;
Takahisa Kaneko, Okazaki, JP;
Masaya Tonomoto, Obu, JP;
Masayoshi Nishihata, Chiryu, JP;
Hiroyuki Wado, Toyota, JP;
Chikage Noritake, Ama-gun, JP;
Eiji Nomura, Kariya, JP;
Toshiki Itoh, Nagoya, JP;
Kuniaki Mamitsu, Nukata-gun, JP;
Takahisa Kaneko, Okazaki, JP;
Masaya Tonomoto, Obu, JP;
Masayoshi Nishihata, Chiryu, JP;
Hiroyuki Wado, Toyota, JP;
Chikage Noritake, Ama-gun, JP;
Eiji Nomura, Kariya, JP;
Toshiki Itoh, Nagoya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.