The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Jan. 17, 2012
Chang Hyun Lim, Seoul, KR;
Chang Jae Heo, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Sung Keun Park, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Chang Jae Heo, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Sung Keun Park, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Gyunggi-Do, KR;
Abstract
Disclosed herein is a semiconductor package, including: a substrate having a first surface and a second surface; at least one semiconductor device formed on the first surface of the substrate; first lead frames respectively formed at both sides of the first surface of the substrate; and second lead frames respectively formed at both sides of the second surface of the substrate, wherein the first lead frame and the second lead frame are spaced apart from each other by an isolation distance base.