The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Apr. 06, 2011
Akira Okuda, Kanuma, JP;
Tatsuyuki Ishikawa, Kanuma, JP;
Naochika Kogure, Kanuma, JP;
Kazunobu Sato, Kanuma, JP;
Akira Okuda, Kanuma, JP;
Tatsuyuki Ishikawa, Kanuma, JP;
Naochika Kogure, Kanuma, JP;
Kazunobu Sato, Kanuma, JP;
JSP Corporation, Tokyo, JP;
Abstract
The present invention relates to an extruded thermoplastic resin foam, particularly relates to a board extruded thermoplastic resin which has low heat conductivity, an excellent heat insulating property over a long period of time, high flame retardancy, and excellent mechanical strength. The extruded thermoplastic resin foam having an apparent density of 20 to 50 kg/m, a closed cells ratio of 85% or more and a thickness of 10 to 150 mm, and containing a non-halogen organic physical blowing agent, wherein the thermoplastic resin composing the extruded foam contains a mixture of 100 parts by weight of a polystyrene resin (A) and 5 to 150 parts by weight of a polyester resin (B), and an endothermic calorific value of the polyester resin (B) less than 5 J/g (including 0) for fusion of the polyester resin on a DSC curve obtained by heat flux differential scanning calorimetry based on JIS K7122 (1987).