The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Feb. 22, 2007
Youn Gon Park, Gyunggi-Do, KR;
Jong Myeon Lee, Gyunggi-Do, KR;
Hai Sung Lee, Gyunggi-Do, KR;
Myung Whun Chang, Seoul, KR;
Ho Sung Choo, Gyunggi-Do, KR;
Youn Gon Park, Gyunggi-Do, KR;
Jong Myeon Lee, Gyunggi-Do, KR;
Hai Sung Lee, Gyunggi-Do, KR;
Myung Whun Chang, Seoul, KR;
Ho Sung Choo, Gyunggi-Do, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.