The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Jul. 22, 2009
Satoshi Fujisawa, Tokyo, JP;
Yuji Suzuki, Tokyo, JP;
Takeo Uno, Tokyo, JP;
Koichi Hattori, Chiba, JP;
Naoya Kuwasaki, Fukuoka, JP;
Satoshi Fujisawa, Tokyo, JP;
Yuji Suzuki, Tokyo, JP;
Takeo Uno, Tokyo, JP;
Koichi Hattori, Chiba, JP;
Naoya Kuwasaki, Fukuoka, JP;
Furukawa Electric Co., Ltd., Tokyo, JP;
Nippon Steel & Sumikin Chemical Co., Ltd., Tokyo, JP;
Abstract
In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni—Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni—Zn alloy is 6% or more and 15% or less of the (Ni deposition amount+Zn deposition amount), and the Zn deposition amount is 0.08 mg/dmor more to provide a flexible copper clad laminate.