The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
Feb. 14, 2007
Hoshiaki Terao, Niigata, JP;
Hiroki Ota, Tokyo, JP;
Hideaki Kobiki, Tokyo, JP;
Aya Uenosono, Osaka, JP;
Hoshiaki Terao, Niigata, JP;
Hiroki Ota, Tokyo, JP;
Hideaki Kobiki, Tokyo, JP;
Satoshi Uenosono, Tokyo, JP;
JFE Precision Corporation, , JP;
JFE Steel Corporation, , JP;
Abstract
In a Cr—Cu alloy that is formed by powder metallurgy and contains a Cu matrix and flattened Cr phases, the Cr content in the Cr—Cu alloy is more than 30% to 80% or less by mass, and the average aspect ratio of the flattened Cr phases is more than 1.0 and less than 100. The Cr—Cu alloy has a small thermal expansion coefficient in in-plane directions, a high thermal conductivity, and excellent processibility. A method for producing the Cr—Cu alloy is also provided. A heat-release plate for semiconductors and a heat-release component for semiconductors, each utilizing the Cr—Cu alloy, are also provided.