The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2013

Filed:

Mar. 25, 2010
Applicants:

Seiichiro Hayashi, Nagoya, JP;

Tomoki Nagae, Nagoya, JP;

Masanari Iwade, Nagoya, JP;

Inventors:

Seiichiro Hayashi, Nagoya, JP;

Tomoki Nagae, Nagoya, JP;

Masanari Iwade, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 47/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A die for forming a honeycomb structure, comprising a platy die base member having a clay supply face on back surface thereof and including a plurality of introduction holes for introducing a mixed raw material for forming; and a clay forming face on upper surface including a plurality of slits for extrusion of the material being connected to the introduction holes and formed lattice-like partition regions; at least a part of lattice-like partition regions being provided in such a position that the extended line of at least part of a plurality of lattice-like regions overlap with the slits at edges thereof as top view, slits including inner peripheral slits formed in the inner peripheral region, and outer peripheral slits formed in the outer peripheral region surrounding the inner peripheral region and having a width-enlarged portion having a width larger than that of the inner peripheral slit, and production method thereof.


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