The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2013

Filed:

May. 26, 2006
Applicant:

Denis J. Stemmle, Stratford, CT (US);

Inventor:

Denis J. Stemmle, Stratford, CT (US);

Assignee:

Lockheed Martin Corporation, Bethesda, MD (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B65H 7/02 (2006.01); B65H 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for stacking objects in a container including the step of measuring a thickness value of each object at a plurality of predetermined locations along a face surface of the respective object. A cumulative thickness profile is developed indicative of a plurality of stacked objects, i.e., juxtaposed along each face surface. The cumulative thickness profile is, furthermore, calculated by summing each of the measured thickness dimensions at each of the predetermined locations. Next, a maximum thickness value is determined as each of the objects is measured and compared to a maximum fill value for each container to determine an overfill condition/number. The overfill condition corresponds to the number of objects which additively cause the maximum thickness value to exceed the maximum fill value. The objects may then be stacked based upon the overfill condition such that the total number of objects is less than the number corresponding to the overfill condition. The method facilitates optimum stacking of objects wherein at least one object has an irregular shape or non-uniform thickness profile.


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