Wafer container with adjustable inside diameter

Abstract

Improvements in a semiconductor wafer container for reducing movement of semiconductor wafers within a wafer carrier using flexible wall segments, panels or flexible inserts in the base member's main inner containment diameter. These walls allow a vertical containment surface to move and capture the entire stack of wafers rather than a few wafers. The surface that contacts the wafers moves uniformly inward. The wafer stack is secured by reducing or eliminating the gap between the wafer container and the wafer stack. Further improvements include the addition of a ramped engagement surfaces in the top and/or bottom cover that provides mechanical advantage for easier assembly of the top and bottom cover. This design also allows for automated loading and unloading of the wafer stack because once the top cover is removed, the flexible walls spring back outward. Thus providing a small gap in which to freely remove the wafers.