The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 15, 2013
Filed:
May. 24, 2011
Yasushi Kurisu, Chiba, JP;
Yoshiaki Shia, Chiba, JP;
Kazuto Yamamura, Chiba, JP;
Yuuichi Ishimori, Chiba, JP;
Hiroyuki Mitake, Chiba, JP;
Tetsuo Shima, Chiba, JP;
Hiroshi Fukuchi, Chiba, JP;
Norimasa Yamasaki, Chiba, JP;
Yasushi Kurisu, Chiba, JP;
Yoshiaki Shia, Chiba, JP;
Kazuto Yamamura, Chiba, JP;
Yuuichi Ishimori, Chiba, JP;
Hiroyuki Mitake, Chiba, JP;
Tetsuo Shima, Chiba, JP;
Hiroshi Fukuchi, Chiba, JP;
Norimasa Yamasaki, Chiba, JP;
Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;
Abstract
A metal plate material hot molding apparatus is provided for press molding a heated metal plate material. The apparatus may include supply piping for a cooling medium in a mold, and ejection holes penetrating from a molding surface of the mold to the supply piping. The exemplary apparatus may also include discharge piping for the cooling medium situated in the mold, and discharge holes penetrating from the molding surface of the mold to the discharge piping, and cooling piping. Molding procedure can be performed while the cooling medium is ejected from the ejection holes to a gap between the metal plate material and the mold.